| 最大层数 | 56 | 102 |
| 最大生产板尺寸 | 533x610mm [21x24"] | 610x1067mm [24x42"] |
| 最小外层线宽/线距 | 50µm/50µm[0.002"/0.002"] | 25µm/25µm[0.001"/0.001"] |
| 最小内层线宽/线距 | 50µm/50µm[0.002"/0.002"] | 25µm/25µm[0.001"/0.001"] |
| 最大板厚 | 5.0mm [0.200"] | 8mm [0.320"] |
| 最小板厚 | .20mm [0.008"] | .10mm [0.004"] |
| 最小机械钻刀 | .10mm [0.004"] | .075mm [0.003"] |
| 最小镭射孔径 | .10mm [0.004"] | .075mm [0.003"] |
| 最大纵横比 | 16:1 | 40:1 |
| 最大基铜厚度 | 5 oz [178µm] | 6 oz [214µm] |
| 最小基铜厚度 | 1/3 oz [12µm] | 1/4 oz [9µm] |
| 最小芯板厚度 | 50µm [0.002"] | 38µm [0.0015"] |
| 最小介质厚度 | 50µm [0.002"] | 38µm [0.0015"] |
| 最小孔PAD尺寸 | 0.1mm [0.004"] | 0.75mm [0.003"] |
| 阻焊对准度 | ± 50µm [0.002"] | ± 38µm [0.0015"] |
| 最小阻焊桥 | 76µm [0.003"] | 64µm [0.0025"] |
| 导体到V-CUT边距离 | 0.40mm [0.016"] | 0.36mm [0.014"] |
| 导体到锣边的距离 | 0.25mm [0.010"] | 0.20mm [0.008"] |
| 成品尺寸公差 | ± 100µm [0.004"] | ±50µm [0.002"] |
|
| 表面处理 | OSP | V |
| HAL | V |
| LF HAL | V |
| ENIG | V |
| ENEPIG | V |
| Soft gold | V |
| Hard gold | V |
| Immersion Silver | V |
| Immersion tin | V |
|
| 材料 | FR4 Normal Tg | Shengyi, ITEQ, KB, NY,TUC |
| FR4 Mid Tg | S1000H, IT158 |
| FR4 High Tg | EMC827,370HR,IT180A,S1000-2 |
| Mid loss | EM370D,TU862F,IT172GRA1,NPG170N |
| Low loss | M4,EM526,TU863+,NPG170D,EM888K,TU872SLK |
| Very Low loss | M6,EM528K,EM891K,TU883SP,IT968G,I-Tera |
| Ultra loss | M7,EM890K,TU933+,IT988G,Astra77,Tachon100G |
| High frequency | Rogers RO4350, RO3003,RF-35,Taconic Series 6 |
| Metal | Shengyi, Yugu YGA,Inventec |