| Board Type类型:BGA Application应用:IC substrate Layers层数:10L Structure结构:5+2+5 Material材料:E-705 Finished THK完成板厚:1.0MM Min W/S线宽线距:25/25um Surface Finish表面处理:ENEPIG |
Board Type类型:FCCSP Application应用:IC substrate Layers层数:2L Structure结构:Through Hole Material材料:HL832 /SI10U Finished THK完成板厚:0.48MM Min W/S线宽线距:40/40um Surface Finish表面处理:ENEPIG |
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| Board Type类型:LGA Application应用:IC substrate Layers层数:4L Structure结构:Through Hole Material材料:HL832 /SI10U Finished THK完成板厚:0.6MM Min W/S线宽线距:30/30um Surface Finish表面处理:ENEPIG |
Board Type类型:MEMS Application应用:IC substrate Layers层数:4L Structure结构:Through Hole Material材料:HL832 /SI10U Finished THK完成板厚:0.6MM Min W/S线宽线距:45/40um Surface Finish表面处理:ENEPIG |
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