| 制前工程 | 文件读入 | Frontline InPlan Planning Software |
| CAM制作 | Orbotech InCAM |
| 光绘菲林 | Orbotech photo plotter |
|
| 内层 | 内层湿膜 | Automatic Wet Film Coater |
| 内层曝光 | Various manual and semi-auto exposure |
| 内层显影蚀刻 | Universal DES( Develop-Etch-Strip) Lines |
| AOI自动光学检测 | Orbotech Discovery, Camtek |
| 棕化 | Universal Alternative Oxide Line |
| 压合 | Burkle, OEM, Heng-da Vacumm Presses |
|
| 钻孔 | 机械钻孔 | Hitachi, Schmoll, HanStar |
| 镭射钻孔 | Mitsubishi Laser Drill |
|
| 外层 | 等离子清洗 | ReBorn RPP-V13 |
| 沉铜 | Automatic Desmear and Electroless Copper |
| 半自动曝光 | 5KW Manual Exposure |
| (内外层)LDI激光直接成像 | Laser Direct Imaging photeck |
| 全板电镀 | Automatic Panel Plating Line |
| Automatic Pattern Plating Line |
| MCP-PAL Vertical Continuous Plating Line |
| Copper Via Fill Plating Tank |
| 外层蚀刻 | Universal SES( Strip-Etch-Tin Strip) Line |
|
| 阻焊及文字 | 阻焊涂饰 | Horizontal Semi Automatic Coater |
| 阻焊曝光 | Various SM Exposure |
| 字符印刷 | Sprint 100 |
|
| 成型 | 数控外形 | CNC Routers + CCD routers |
| V-Cut | CNC V-score |
| 模冲外形 | Punch |
| 斜边 | Bevel |
|
| 表面处理 | 有铅喷锡 | Tin/Lead HASL |
| 无铅喷锡 | Lead Free HASL |
| 沉金 | Uyemura |
| 沉镍钯金 | Successful |
| 沉银 | MacDermid(Planar) |
| 沉锡 | Atotech(Stannatech) |
| 防氧化 | OSP |
| 镀硬金 | Full body gold, gold fingers and selective gold |
| 闪金 | Full body and selevtive bondable soft gold |
|
| 测试与终检 | 测试架测试 | 2wire / 4wire Fxiture Test |
| 飞针测试 | 2wire / 4wire Flying Probe Test |
| 可靠性测试 | X-section and Microscopes, Impendence Test, High-Pot, |
| Tg Test, Peel Strength, lonic Testing, IR Reflow, Thermal Chamber etc chrommotography,IST,CAF |