| Board Type类型:Rigid-flex+HDI Application应用:Wearable 穿戴 Layers层数:10L Structure结构:3+4F+3 / 3阶4层软板 Material材料:EM370D Finished THK完成板厚:0.8MM Min W/S线宽线距:2/2mil Surface Finish表面处理:ENIG 化学沉金 |  |  |
 |  | Board Type类型:Rigid-flex+HDI Application应用:SSD 固态硬盘 Layers层数:14L Structure结构:4+6+4(6+2F+6) 4阶2层软板 Material材料:EM370D Finished THK完成板厚:1.1MM Min W/S线宽线距:2.5/3.0mil Surface Finish表面处理:ENIG 化学沉金 |
Board Type类型:Rigid-flex+HDI Application应用:Communication 光模块 Layers层数:10L Structure结构:4+2F+4 任意阶 Material材料:EM528K Finished THK完成板厚:1.1MM Min W/S线宽线距:2.5/3.0mil Surface Finish表面处理:ENIG 化学沉金 |  |  |