| Roadmap | |||||
| 类别 Category | 特性 Features | 2021 Standard | 2021 Advanced | 2022 R&D | 2023 R&D |
|---|---|---|---|---|---|
| 关键属性 Key Attribute | 层数 Layers | 2L to 56L | Up to 102L | 106L | >100+L |
| 板厚 Thickness | .200" [5.0] | .320" [8.0] | .400" [10.0] | TBD/≥.400" [10.0] | |
| 最大 Max PNL | 18x24[457x610] | 24x30[610 x 762] | 24x42[610 x 1067] | TBA | |
| 最小线宽线距 （13um铜厚） Min W/S (13um) | 内层Inner | .002" [.05] | .001" [.025] | .001" [.025] | <.001" [.025] |
| 外层Outer | .002" [.05] | .0016" [.040] | 001" [.025] | <.001" [.025] | |
| 公差Tolerance | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.006] | ±.0002" [.005] | |
| 机械孔大小 Mechanical hole | 钻咀Bit | .006" [.15] | .004" [.10] | .003" [.075] | .003" [.075] |
| PAD直径Diameter | +.008" [.20] | +.006" [.15] | +.004" [.10] | +.003" [.075] | |
| 厚径比 AR | 16:1 | 40:1 | 50:1 | 60:1 | |
| 孔结构 Hole structure | 镭射孔层 Laser Structure | ELIC(12L) | ELIC(16L) | ELIC(18L) | ELIC(20L) |
| 埋孔 Buried | Yes | Yes | Yes | Yes | |
| 叠孔 Stacked | Yes | Yes | Yes | Yes. | |
| 镭射孔 Laser via | 最小孔 Min | .004" [.10] | .003" [.075] | .003" [.075] | .002" [.05] |
| Pad直径 Diameter | +.006" [.15] | +.004" [.10] | +.004" [.10] | +.003" [.075] | |
| 厚径比 AR | 0.8:1 | 1:1 | 1:1 | 1:1 | |
| 阻焊 Soldermask | 对位 Alignment | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| 最小开窗 Opening | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| 最小绿油桥 Bridge | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |