Board Type类型:Rigid HDI 硬板HDI

Application应用:Industry 工业设备

Layers层数:24L

Structure结构:5+14+5

Material材料:EM370Z

Finished THK完成板厚:2.95MM

Min W/S线宽线距:2.5/3.2mil

Surface Finish表面处理:ENIG 化学沉金

Board Type类型:Rigid Anylayer 任意阶HDI

Application应用:Communication 通信模块

Layers层数:12L

Structure结构:Anylayer

Material材料:EM390

Finished THK完成板厚:1.0MM

Min W/S线宽线距:2.2/2.0mil

Surface Finish表面处理:OSP