Board Type类型:Rigid+HDI+High speed

Application应用:Industry

Layers 层数:       12L

Structure结构:    2+8+2

Material材料:      M6G

Finished THK完成板厚:1.6MM

Min W/S线宽线距:       3.0/3.5mil

Surface Finish表面处理:OSP

Remarks备注：High Speed+Buried+Stacked 

Board Type类型:Rigid HDI +High frequency

Application应用:Automative Radar

Layers层数:5L

Structure结构:1-2,1-3, 5-4,5-3

Material材料:R3003+EM370D

Finished THK完成板厚:1.0MM

Min W/S线宽线距:4.0/4.6mil

Surface Finish表面处理:Immersion Tin

Remarks备注：High Frequency+ High Tg

                       +Mechanical blind

Board Type类型:Rigid HDI+High Speed

Application应用:Communication-Optical module

Layers层数:12L

Structure结构:3+6+3+Coin

Material材料:M7N

Finished THK完成板厚:1.0MM

Min W/S线宽线距:2.1/2.5mil

Surface Finish表面处理:ENEPIG

Remarks备注：Cavity+ Bonding to Edge max2mil,

                        Min: 0.3um Pa + Coin