Board Type类型:Probe card

Application应用:Semiconductor 测试板

Layers层数:102L

Structure结构:Through hole通孔

Material材料:EM827

Finished THK完成板厚:7.0MM

Min W/S线宽线距:3.0/3.2mil

Surface Finish表面处理:ENIG+ Hard gold

Board Type类型:Burn-in

Application应用:Semiconductor 测试板

Layers层数:26L

Structure结构:Through hole 通孔

Material材料:IT180A

Finished THK完成板厚:2.8MM

Min W/S线宽线距:4.0/4.5mil

Surface Finish表面处理:ENIG+ Hard gold