Board Type:Rigid-flex+HDI Application:Wearable Layers:10L Structure:3+4F Material:EM370D Finished THK:0.8MM Min W/S:2/2mil Surface Finish:ENIG |  |  |
 |  | Board Type:Rigid-flex+HDI Application:SSD Layers:14L Structure:4+6+4(6+2F+6) 4 steps2L Flex Material:EM370D Finished THK:1.1MM Min W/S:2.5/3.0mil Surface Finish:ENIG |
Board Type:Rigid-flex+HDI Application:Communication Layers:10L Structure:4+2F+4 Material:EM528K Finished THK:1.1MM Min W/S:2.5/3.0mil Surface Finish:ENIG |  |  |