| Max Layer count | 56 | 102 |
| Max Panel size | 533x610mm [21x24"] | 610x1067mm [24x42"] |
| Min Outer Line W/S | 50µm/50µm[0.002"/0.002"] | 25µm/25µm[0.001"/0.001"] |
| Min Inner Line W/S | 50µm/50µm[0.002"/0.002"] | 25µm/25µm[0.001"/0.001"] |
| Max Board Thickness | 5.0mm [0.200"] | 8mm [0.320"] |
| Min Board Thickness | .20mm [0.008"] | .10mm [0.004"] |
| Min Mechanical hole | .10mm [0.004"] | .075mm [0.003"] |
| Min Laser Drill hole | .10mm [0.004"] | .075mm [0.003"] |
| Max Art Ratio | 16:1 | 40:1 |
| Max Base copper Thick | 5 oz [178µm] | 6 oz [214µm] |
| Min Base copper Thick | 1/3 oz [12µm] | 1/4 oz [9µm] |
| Min Core Thickness | 50µm [0.002"] | 38µm [0.0015"] |
| Min Dielectric Thickness | 50µm [0.002"] | 38µm [0.0015"] |
| Min Pad on hole | 0.1mm [0.004"] | 0.75mm [0.003"] |
| SM Registration | ± 50µm [0.002"] | ± 38µm [0.0015"] |
| Min SM Bridge | 76µm [0.003"] | 64µm [0.0025"] |
| Distance between copper to V-CUT | 0.40mm [0.016"] | 0.36mm [0.014"] |
| Distance between copper to Rout edge | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Board size tolerance | ± 100µm [0.004"] | ±50µm [0.002"] |
|
| Surface Finish | OSP | V |
| HAL | V |
| LF HAL | V |
| ENIG | V |
| ENEPIG | V |
| Soft gold | V |
| Hard gold | V |
| Immersion Silver | V |
| Immersion tin | V |
|
| Material | FR4 Normal Tg | Shengyi, ITEQ, KB, NY,TUC |
| FR4 Mid Tg | S1000H, IT158 |
| FR4 High Tg | EMC827,370HR,IT180A,S1000-2 |
| Mid loss | EM370D,TU862F,IT172GRA1,NPG170N |
| Low loss | M4,EM526,TU863+,NPG170D,EM888K,TU872SLK |
| Very Low loss | M6,EM528K,EM891K,TU883SP,IT968G,I-Tera |
| Ultra loss | M7,EM890K,TU933+,IT988G,Astra77,Tachon100G |
| High frequency | Rogers RO4350, RO3003,RF-35,Taconic Series 6 |
| Metal | Shengyi, Yugu YGA,Inventec |