PE Engineer | File Input | Frontline InPlan Planning Software |
CAM | Orbotech InCAM |
A/W | Orbotech photo plotter |
|
Inner Layer | Inner Film | Automatic Wet Film Coater |
Inner Exposure | Various manual and semi-auto exposure |
Inner Layer Etch | Universal DES( Develop-Etch-Strip) Lines |
AOI Inspection | Orbotech Discovery, Camtek |
Brown Oxide | Universal Alternative Oxide Line |
Laminating | Burkle, OEM, Heng-da Vacumm Presses |
|
Drilling | Mechnical Drill | Hitachi, Schmoll, HanStar |
Laser Drill | Mitsubishi Laser Drill |
|
Ourer Layer | Plasma Clean | ReBorn RPP-V13 |
PTH | Automatic Desmear and Electroless Copper |
Semi-Exposure | 5KW Manual Exposure |
LDI machine | Laser Direct Imaging photeck |
Pattern Palting | Automatic Panel Plating Line |
Automatic Pattern Plating Line |
MCP-PAL Vertical Continuous Plating Line |
Copper Via Fill Plating Tank |
Outer Layer Etch | Universal SES( Strip-Etch-Tin Strip) Line |
|
SM & Marking | SM Printing | Horizontal Semi Automatic Coater |
SM Exposure | Various SM Exposure |
Legend | Sprint 100 |
|
Ourline | CNC | CNC Routers + CCD routers |
V-Cut | CNC V-score |
Punch Die | Punch |
Chamfer | Bevel |
|
Surface finish | HASL | Tin/Lead HASL |
Leadfree Hasl | Lead Free HASL |
ENIG | Uyemura |
ENEPIG | Successful |
Imm. Ag | MacDermid(Planar) |
Imm. Tin | Atotech(Stannatech) |
ENTEK | OSP |
Hard FGold | Full body gold, gold fingers and selective gold |
Flash Gold | Full body and selevtive bondable soft gold |
|
Test & Inspection | E-T Fixture | 2wire / 4wire Fxiture Test |
Flying Probe | 2wire / 4wire Flying Probe Test |
Reliability Test | X-section and Microscopes, Impendence Test, High-Pot, |
Tg Test, Peel Strength, lonic Testing, IR Reflow, Thermal Chamber etc chrommotography,IST,CAF |